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Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) Technical Data
HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F HSMP-481B, -482B, -489B
Features
* Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation * Surface Mount SOT-323 (SC-70)Package Single and Pair Versions Tape and Reel Options Available * Low Failure in Time (FIT) Rate* * For more information see the Surface Mount PIN Reliability Data Sheet.
Package Lead Code Identification (Top View)
SINGLE SERIES
Description/Applications
The HSMP-381B/C/E/F series is specifically designed for low distortion attenuator applications. The HSMP-386B/C/E/F series is a general purpose PIN diode designed for low current attenuators and low cost switches. The HSMP-389B/C/E/ F series is optimized for switching applications where low resistance at low current, and low capacitance are required. The HSMP-48XB series is special products featuring ultra low parasitic inductance in the SOT323 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-323 PIN diodes. The HSMP-481B diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP-482B diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-489B is optimized for low current switching applications up to 3 GHz.
B COMMON ANODE
C COMMON CATHODE
E DUAL ANODE
F DUAL CATHODE
482B / 489B
481B
Absolute Maximum Ratings [1], TC = + 25C
Symbol Parameter If Piv TJ TSTG jc Unit Absolute Maximum 1 Same as VBR 150 -65 to 150 300 Forward Current (1 s Pulse) Amp Peak Inverse Voltage V Junction Temperature C Storage Temperature C [2] Thermal Resistance C/W
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = 25C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
2
Electrical Specifications, TC = +25C, each diode
PIN Attenuator Diodes
Part Package Number Marking Lead HSMP- Code[1] Code Configuration 381B 381C 381E 381F E0 E2 E3 E4 B C E F Single Series Common Anode Common Cathode Minimum Maximum Maximum Minimum Maximum Breakdown Total Total High Low Voltage Resistance Capacitance Resistance Resistance VBR (V) RT () CT (pF) RH () RL () 100 3.0 0.35 1500 10
Test Conditions
VR = VBR Measure IR 10 A
IF = 100 mA f = 100 MHz
VR = 50 V f = 1 MHz
IR = 0.01 mA IF = 20 mA f = 100 MHz f = 100 MHz
PIN General Purpose Diodes
Part Number HSMP386B 386C 386E 386F Package Marking Code[1] L0 L2 L3 L4 Minimum Breakdown Voltage VBR (V) 50 Typical Total Resistance RT () 3.0 1.5* Typical Total Capacitance CT (pF) 0.20
Lead Code B C E F
Configuration Single Series Common Anode Common Cathode
Test Conditions
VR = VBR Measure IR 10 A
IF = 10 mA f = 100 MHz IF = 100 mA*
VR = 50 V f = 1 MHz
PIN Switching Diodes
Part Number HSMPPackage Marking Code[1] Minimum Breakdown Voltage VBR (V) 100 Maximum Total Resistance RT () 2.5 Maximum Total Capacitance CT (pF) 0.30
Lead Code B C E F
Configuration Single Series Common Anode Common Cathode
389B G0 389C G2 389E G3 389F G4 Test Conditions
VR = VBR Measure IR 10 A
IF = 5 mA f = 100 MHz
VR = 5 V f = 1 MHz
3
Electrical Specifications, TC = +25C, each diode, continued Typical Parameters
Part Number HSMP381A Series 386A Series 389A Series Test Conditions Total Resistance Carrier Lifetime RT () (ns) 75 22 3.8 IF = 1 mA f = 100 MHz 1500 500 200* IF = 50 mA TR = 250 mA IF = 10 mA* IR = 6 mA* Reverse Recovery Time Trr (ns) 300 80 -- VR = 10 V IF = 20 mA 90% Recovery Total Capacitance (pF) 0.27 0.20 -- 50 V
Note: 1. Package marking code is laser marked.
High Frequency (Low Inductance, 500 MHz - 3 GHz PIN Diodes
Part Number HSMP481B 482B 489B Minimum Maximum Typical Maximum Typical Package Breakdown Series Total Total Total Marking Voltage Resistance Capacitance Capacitance Inductance Code Configuration VBR (V) R S () C T (pF) C T (pF) L T (nH) Application EB FA GA Dual Cathode Dual Anode Dual Anode 100 50 100 VR = VBR Measure IR 10 A 3.0 0.6* 2.5** IF = 100 mA IF = 10 mA* IF = 5 mA** 0.35 0.75* 0.33** VR = 50 V f = 1 MHz VR = 20 V* VR = 5 V** 0.4 1.0 0.375* VR = 50 V f = 1 MHz VR = 5 V* 1.0 1.0* 1.0 f =500 MHz - 3 GHz VR = 20 V* Attenuator Limiter Switch
Test Conditions
4
Typical Performance, TC = 25C
0.45 TOTAL CAPACITANCE (pF) 0.40 0.35 1 MHz 0.30 0.25 0.20 frequency>100 MHz 0.15 0 2 4 6 8 10 12 14 16 18 20 30 MHz TOTAL CAPACITANCE (pF) 0.35 10000 HSMP-381B/C/E/F, -481B 0.30 1 MHz 0.25 100 MHz 0.20 1 GHz RF RESISTANCE (OHMS) 1000
100
HSMP386B/C/E/F HSMP-482B
10
1 HSMP-389B/C/E/F, -489B
0.15
0
2
4
6
8
10 12 14 16 18 20
REVERSE VOLTAGE (V)
REVERSE VOLTAGE (V)
0.1 0.01 0.1 1 10 100 IF - FORWARD BIAS CURRENT (mA)
Figure 1. RF Capacitance vs. Reverse Bias, HSMP-381B/C/E/F Series.
Figure 2. RF Capacitance vs. Reverse Bias, HSMP-386B/C/E/F Series.
Figure 3. Total RF Resistance at 25 C vs. Forward Bias Current.
10000 TOTAL RF RESISTANCE (OHMS)
1000
CT - CAPACITANCE (pF)
1.2 1 0.8 0.6 0.4 0.2
HSMP-482B
INPUT INTERCEPT POINT (dBm)
TA = +85C TA = +25C TA = -55C
1.4 HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F
120
Diode Mounted as a 110 Series Attenuator in a 50 Microstrip and 100 Tested at 123 MHz 90 80 70 60 50 40 1000 100 10 HSMP-381B/C/E/F
100
10
1.0 0.01 0.1 1 10 100 IF - FORWARD BIAS CURRENT (mA)
0
0
10
20
30
40
50
VR - REVERSE VOLTAGE (V)
DIODE RF RESISTANCE (OHMS)
Figure 4. RF Resistance vs. Forward Bias Current for HSMP-381B/C/E/F Series and HSMP-481B.
Figure 5. Capacitance vs. Reverse Voltage at 1 MHz.
Figure 6. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuator Diodes.
Trr - REVERSE RECOVERY TIME (ns)
INPUT INTERCEPT POINT (dBm)
Diode Mounted as a 115 Series Switch in a 50 Microstrip and 110 Tested at 123 MHz 105 HSMP-3880 HSMP-389B/C/E/F 100 95 90 85 1 HSMP-386B/C/E/F 10 30
VR = 2V VR = 5V 10 VR = 10V
Trr - REVERSE RECOVERY TIME (nS)
120
100
1000
VR = 5V 100 VR = 10V VR = 20V
1 10
20 FORWARD CURRENT (mA)
30
10 10
20 FORWARD CURRENT (mA)
30
IF - FORWARD BIAS CURRENT (mA)
Figure 7. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes.
Figure 8. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-482B.
Figure 9. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-386B/C/E/F Series.
5
Typical Performance, TC = 25C
Trr - REVERSE RECOVERY TIME (nS)
200
IF - FORWARD CURRENT (mA)
100
IF - FORWARD CURRENT (mA)
100
160 VR = -2V 120
10
10
1
1
80 VR = -5V 40 VR = -10V 0 10 15 20 25 30
0.1
0.1 125C 25C -50C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2
0.01
125C 0 0.2 0.4
25C -50C 0.6 0.8 1.0 1.2
FORWARD CURRENT (mA)
VF - FORWARD VOLTAGE (mA)
VF - FORWARD VOLTAGE (mA)
Figure 10. Typical Reverse Recovery Time vs. Reverse Voltage. HSMP-389B/C/E/F Series.
100
IF - FORWARD CURRENT (mA)
Figure 11. Forward Current vs. Forward Voltage. HSMP-381B/C/E/F Series and HSMP-481B.
100
IF - FORWARD CURRENT (mA)
Figure 12. Forward Current vs. Forward Voltage. HSMP-482B.
10
10
1
1
0.1 125C 0 0.2 0.4 25C -50C 0.6 0.8
0.1
0.01
1.0
1.2
0.01
125C 25C -50C 0 0.2 0.4 0.6 0.8 1.0 1.2
VF - FORWARD VOLTAGE (V)
VF - FORWARD VOLTAGE (V)
Figure 13. Forward Current vs. Forward Voltage. HSMP-386B/C/E/F Series.
Figure 14. Forward Current vs. Forward Voltage. HSMP-389B/C/E/F Series and HSMP-489B.
6
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1 RF 1 RF 2
RF 2
BIAS 1
BIAS 2
BIAS
BIAS
Figure 15. Simple SPDT Switch, Using Only Positive Bias Current.
Figure 16. High Isolation SPDT Switch.
RF COMMON BIAS
RF COMMON
RF 1
RF 2 RF 1 BIAS RF 2
Figure 17. SPDT Switch Using Both Positive and Negative Bias Current.
Figure 18. Very High Isolation SPDT Switch.
7
Typical Applications for Multiple Diode Products (continued)
VARIABLE BIAS
INPUT
RF IN/OUT
FIXED BIAS VOLTAGE
Figure 19. Four Diode Attenuator.
BIAS
Figure 20. High Isolation SPST Switch (Repeat Cells as Required).
8
Typical Applications for HSMP-48XX Low Inductance Series
3 3
Microstrip Series Connection for HSMP-48XB Series
In order to take full advantage of the low inductance of the HSMP-48XB series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 21.
1 2 HSMP-481B 1 HSMP-489B 2
Figure 21. Internal Connections.
Figure 22. Circuit Layout.
Microstrip Shunt Connections for HSMP-48XB Series
In Figure 23, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the HSMP-48XB series diode are placed across the resulting gap. This forces the 0.5 nH lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material.
50 OHM MICROSTRIP LINES
PAD CONNECTED TO GROUND BY TWO VIA HOLES
Figure 23. Circuit Layout.
1.5 nH
1.5 nH
0.3 pF*
0.3 nH
0.3 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 24. Equivalent Circuit.
9
Typical Applications for HSMP-48XX Low Inductance Series (continued)
Co-Planar Waveguide Shunt Connection for HSMP-48XB Series
Co-Planar waveguide, with ground on the top side of the printed circuit board, is shown in Figure 25. Since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit.
Co-Planar Waveguide Groundplane Center Conductor Groundplane
Figure 25. Circuit Layout.
0.3 pF*
0.75 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 26. Equivalent Circuit.
10
Assembly Information
SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 27 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance.
0.026
0.07 0.035
SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323 package, will reach solder reflow temperatures faster than those with a greater mass. HP's SOT-323 diodes have been qualified to the time-temperature profile shown in Figure 28. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)
250
passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 C. These parameters are typical for a surface mount assembly process for HP SOT-323 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.
0.016
Figure 27. PCB Pad Layout (dimensions in inches).
TMAX 200
TEMPERATURE (C)
150 Reflow Zone 100 Preheat Zone 50 0 0 60 120 180 240 300 TIME (seconds) Cool Down Zone
Figure 28. Surface Mount Assembly Profile.
11
Device Orientation
REEL TOP VIEW 4 mm END VIEW
CARRIER TAPE USER FEED DIRECTION COVER TAPE
8 mm
##
##
##
##
Note: "##" represents Package Marking Code.
Tape Dimensions
For Outline SOT-323 (SC-70 3 Lead)
P P0 D P2
E
F W C
D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)
8 MAX.
K0
5 MAX.
A0
B0
DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER DIAMETER PITCH POSITION WIDTH THICKNESS WIDTH TAPE THICKNESS CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION)
SYMBOL A0 B0 K0 P D1 D P0 E W t1 C Tt F P2
SIZE (mm) 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 1.55 0.05 4.00 0.10 1.75 0.10 8.00 0.30 0.255 0.013 5.4 0.10 0.062 0.001 3.50 0.05 2.00 0.05
SIZE (INCHES) 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 0.061 0.002 0.157 0.004 0.069 0.004 0.315 0.012 0.010 0.0005 0.205 0.004 0.0025 0.00004 0.138 0.002 0.079 0.002
PERFORATION
CARRIER TAPE COVER TAPE DISTANCE
Package Dimensions
Outline SOT-323 (SC-70)
1.30 (0.051) REF.
2.20 (0.087) 2.00 (0.079)
1.35 (0.053) 1.15 (0.045)
0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.425 (0.017) TYP.
0.30 REF.
0.25 (0.010) 0.15 (0.006)
1.00 (0.039) 0.80 (0.031)
10
0.30 (0.012) 0.10 (0.004)
0.20 (0.008) 0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ........................................................................................ Copper Lead Finish............................................................................. Tin-Lead 85/15% Maximum Soldering Temperature ............................... 260C for 5 seconds Minimum Lead Strength ........................................................... 2 pounds pull Typical Package Inductance ................................................................... 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP- 38XA - XXX
Bulk or Tape and Reel Option Part Number Surface Mount PIN Hewlett-Packard Option - BLK = Bulk, 100 pcs. per antistatic bag Option - TR1 = Tape and Reel, 3000 devices per 7" reel Conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement." Standard Quantity is 3,000 Devices per Reel.
www.hp.com/go/rf For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5966-2323E Printed in U.S.A. 5967-6070E (5/98)

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